Shanghai Hejing: Proposed Private Placement to Raise No More Than 900 Million Yuan

Shanghai Hejing announces plans to issue A-shares to specific investors, raising no more than 900 million yuan. After deducting issuance costs, the net proceeds will be invested in the 12-inch semiconductor large silicon wafer industrialization project (planned investment of 700 million yuan) and supplementary working capital (planned investment of 200 million yuan). The total number of shares issued will not exceed 39.9275 million, with an issuance price not lower than 80% of the average trading price of the company’s shares during the 20 trading days before the pricing reference date. After the issuance is completed, the shares subscribed to by the investors cannot be transferred within six months from the end of the issuance.